Model | i-PULSE 'S10' i-PULSE 'S20' |
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Launch Date | September 01, 2015 |
Target Sales | 100 Units (one year from release, both within Japan and internationally) |
Model name | S10 | S20 | |
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Board Size | With buffer unused | Min. L50 x W30mm to Max. L980 x W510mm | Min. L50 x W30mm to Max. L1,480 x W510mm |
With input or output buffers used | Min. L50 x W30mm to Max. L420 x W510mm | -- | |
With input and output buffers used | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm | |
With input and output buffers used | 0.4 - 5.0mm | ||
Placement accuracy A (μ+3σ) | CHIP ± 0.040mm | ||
Placement accuracy B (μ+3σ) | IC ± 0.025mm | ||
Placement angle | ± 180° | ||
Component height (Board thickness + component height) | 6-axis 6-theta head: Max. 35mm 12-axis 2-theta head: Max. 20mm | ||
Applicable Components | 0201-120mm x 90mm, BGA, CSP,Connectors, other odd-shaped components | ||
Component package | 8-56mm tape (F1/F2 Feeders), 8-88mm tape (F3 Electric Feeders), Stick, Tray | ||
Component types (8mm tape conversion) | Max. 90 types (8mm tape), 45 lanes x 2 | Max. 180 types (8mm tape), 45 lanes x 4 | |
Transfer height | 900 ± 20mm | ||
Machine Dimensions | L1,250 x D1,770 x H1,420mm | L1,750 x D1,770 x H1,420mm | |
Weight | Approx. 1,200kg | Approx. 1,500kg |